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Deep Trench (DT)
This Deep Trench mode is for Bruker’s automated AFMs. For Deep Trench measurements with Bruker’s Dimension Icon, see Peak Force Deep Trench.
Deep Trench (DT) Mode is a proprietary AFM mode developed by Bruker especially for the repeatable measurement of deep semiconductor trench structures < 90 nm. This adaptive scan method, which only collects data when specific system state conditions are met, provides inline metrology capability for semiconductor fabrication. DT Mode only collects data points when “good” scan criteria are met, resulting in improved measurement precision.
Frequency
Nom: 300KHz
Spring Const.
Nom: 40N/m
Geometry
RectangularMaterial
0.01 - 0.025Ωcm Antimony (n) doped SiCoating
B: Reflective Aluminum
Frequency
Nom: 320KHz
Spring Const.
Nom: 42N/m
Geometry
Rectangular
Tip Radius
10nmMaterial
0.01 - 0.025 Ωcm Antimony (n) doped SiCoating
B: Reflective Aluminum
Frequency
Nom: 320KHz
Spring Const.
Nom: 42N/m
Geometry
RectangularMaterial
0.01 - 0.025Ωcm Antimony (n) doped SiCoating
B: Reflective Aluminum
Frequency
Nom: 300KHz
Spring Const.
Nom: 40N/m
Geometry
RectangularMaterial
0.01 - 0.025Ωcm Antimony (n) doped SiCoating
B: Reflective Aluminum
Frequency
Nom: 320KHz
Spring Const.
Nom: 42N/m
Geometry
Rectangular
Tip Radius
10nmMaterial
0.01 - 0.025 Ωcm Antimony (n) doped Si
Frequency
Nom: 292KHz
Spring Const.
Nom: 35N/m
Geometry
RectangularMaterial
0.010 - 0.025 Ωcm SiliconCoating
B: Reflective Aluminum