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Product Description:

The FIB3D2-100A has a 100nm wide spike at 2 um from the spike apex.  The spike is tilt-compensated by 3 degrees and the cantilever has Aluminum reflex coating.

Focused Ion Beam (FIB) probes consist of an integrated single crystal TESP silicon cantilever and tip that have been machined (or shaped) to obtain the desired high aspect ratio.  They have near vertical sidewalls and aspect ratios of more than 10:1.  Common applications include semiconductor devices, 3-D micro-optics, and development of precision metrology methods.  FIB tips are designed only for TappingMode and for profiling narrow gaps.  FIB tips should not be used in contact mode. 

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Model Instrument Mount Pack Size Price Pack Quantity
FIB3D2-100A Automated AFM Unmounted 5 $1,000.00 (USD)

Shape Resonant Freq. kHz Spring Const. N/m Length µm Width µm
Nom. Min. Max. Nom. Min. Max. Nom. Min. Max. Nom. Min. Max.
Rectangular 320 230 410 42 20 80 125 140 110 40 30 50

Tip Specification

Geometry: High Aspect Ratio
Tip Height (h): 10 - 15µm
Front Angle (FA): 1 ± 0.5º
Back Angle (BA): 1 ± 0.5 º
Side Angle (SA): 1 ± 0.5 º
Tip Radius (Nom): 10 nm
Tip Radius (Max): 15 nm
Tip SetBack (TSB)(Nom): 15 µm
Tilt Compensation: 3º
Tip Set Back (TSB)(RNG): 5 - 25 µm
SpikeH(Rng): 4000 - 6000 nm
SpikeW: 100 nm

Cantilever Specification

Aluminum reflective coating on the backside of the cantilever. The Al Reflective coating increases the laser signal (A+B) by up to 2.5 times. Although not necessary for general imaging, reflective coating is recommended for thin cantilevers, highly reflective samples, and machine vision applications.
Material: 0.01 - 0.025 Ωcm Antimony (n) doped Si
Geometry: Rectangular
Cantilevers Number: 1
Cantilever Thickness (Nom): 4 µm
Cantilever Thickness (RNG): 3.25 - 4.75 µm
Back Side Coating: Reflective Aluminum
Top Layer Back: 45 ± 5nm of Al