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TESPA-HAR

Product Description:

42N/m, 320kHz, High Aspect Ratio Tip (5:1), Aluminum Reflective Coating

High aspect ratio (HAR) probes are based upon Bruker technology and made from Bruker TESP probes using focused ion beam milling techniques.  The HAR process modifies the top portion of the tip to an aspect ratio of at least 5:1.  These probes are ideal for Tappingmode imaging on samples with tall/deep geometries, such as semiconductor trench imaging.

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Model Mount Pack Size Price Pack Quantity
TESPA-HAR Unmounted 10 $910.00 (USD)

Quantity discounts available

QtyPrice/Pack
2-6$819.00 (USD)
7-15$773.50 (USD)
16-24$728.00 (USD)
25-37$682.50 (USD)
38+$546.00 (USD)



Shape Resonant Freq. kHz Spring Const. N/m Length µm Width µm
Nom. Min. Max. Nom. Min. Max. Nom. Min. Max. Nom. Min. Max.
Rectangular 320 230 410 42 20 80 125 140 110 40 30 50

Tip Specification

Geometry: High Aspect Ratio
Tip Height (h): 10 - 15µm
Front Angle (FA): 5 ± 1º
Back Angle (BA): 5 ± 1 º
Side Angle (SA): 5 ± 1 º
Tip Radius (Nom): 10 nm
Tip Radius (Max): 15 nm
Tip SetBack (TSB)(Nom): 15 µm
Tilt Compensation: 0º
Tip Set Back (TSB)(RNG): 5 - 25 µm
SpikeH(Rng): 4000 - 5000 nm
SpikeW: 200 nm

Cantilever Specification

Aluminum reflective coating on the backside of the cantilever. The Al Reflective coating increases the laser signal (A+B) by up to 2.5 times. Although not necessary for general imaging, reflective coating is recommended for thin cantilevers, highly reflective samples, and machine vision applications.
Material: 0.01 - 0.025 Ωcm Antimony (n) doped Si
Geometry: Rectangular
Cantilevers Number: 1
Cantilever Thickness (Nom): 4 µm
Cantilever Thickness (RNG): 3.25 - 4.75 µm
Back Side Coating: Reflective Aluminum
Top Layer Back: 45 ± 5nm of Al
Optional Product Offerings
TESP-HAR
42N/m, 320kHz, High Aspect Ratio (5:1), No Reflect...
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