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TESPW

Product Description:

***Note: The final day for ordering the TESPW probe will be January 31, 2015, after which point, it will become obsolete and replaced by the new model TESPW-V2.  Read the TESPW obsolescence notification letter here and contact your local Bruker representative if you have any questions or concerns.

Bruker's premier line of etched silicon probes are the industry standardfor imaging in TappingMode and non-contact mode in air.  Tightspecification control, unrivaled sensitivity, and dependably sharp tipsall contribute to producing consistently accurate, high-resolutionimages. 

This AFM probe is unmounted for use on any AFM and is also available with Aluminum reflex coating as model TESPAW. 

For a probe with similar specifications at a lower cost try the NCHV-W probe, part of Bruker's new VALUE line!
Shape Resonant Freq. kHz Spring Const. N/m Length µm Width µm
Nom. Min. Max. Nom. Min. Max. Nom. Min. Max. Nom. Min. Max.
Rectangular 320 230 410 42 20 80 125 110 140 30 25 35

Tip Specification

*Due to the inherent danger of mishandling or contamination during extraction of probes by non-Bruker personnel, we do not guarantee performance of wafers once opened at the consumers site. Instead, we highly recommend buying in larger quantities of 10-packs to guarantee performance, taking advantage of quantity discount pricing.
Geometry: Standard (Steep)
Tip Height (h): 10 - 15µm
Front Angle (FA): 25 ± 2.5º
Back Angle (BA): 15 ± 2.5 º
Side Angle (SA): 22.5 ± 2.5 º
Tip Radius (Nom): 8 nm
Tip Radius (Max): 12 nm
Tip SetBack (TSB)(Nom): 15 µm
Tip Set Back (TSB)(RNG): 5 - 25 µm

Cantilever Specification

Material: 0.01 - 0.025 Ωcm Antimony (n) doped Si
Geometry: Rectangular
Cantilevers Number: 1
Cantilever Thickness (Nom): 4 µm
Cantilever Thickness (RNG): 3.25 - 4.75 µm
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