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TESP

Product Description:

***Note: The final day for ordering the TESP probe will be January 31st, 2015, after which point, it will become obsolete and replaced by the new model TESP-V2.  Please read the TESP obsolescence notification letter here and contact your local Bruker representative if you have any questions or concerns.

Bruker's premier line of etched silicon probes are the industry standard for imaging in TappingMode and non-contact mode in air.  Tight specification control, unrivaled sensitivity, and dependably sharp tips all contribute to producing consistently accurate, high-resolution images. 

This AFM probe is unmounted for use on any AFM and is also available with Aluminum reflex coating as model TESPA

For a probe with similar specifications at a lower cost try the NCHV probe, part of Bruker's new VALUE line!
Shape Resonant Freq. kHz Spring Const. N/m Length µm Width µm
Nom. Min. Max. Nom. Min. Max. Nom. Min. Max. Nom. Min. Max.
Rectangular 320 230 410 42 20 80 125 110 140 40 30 50

Tip Specification

Geometry: Standard (Steep)
Tip Height (h): 10 - 15µm
Front Angle (FA): 25 ± 2.5º
Back Angle (BA): 15 ± 2.5 º
Side Angle (SA): 22.5 ± 2.5 º
Tip Radius (Nom): 8 nm
Tip Radius (Max): 12 nm
Tip SetBack (TSB)(Nom): 15 µm
Tip Set Back (TSB)(RNG): 5 - 25 µm

Cantilever Specification

Material: 0.01 - 0.025 Ωcm Antimony (n) doped Si
Geometry: Rectangular
Cantilevers Number: 1
Cantilever Thickness (Nom): 4 µm
Cantilever Thickness (RNG): 3.25 - 4.75 µm
Optional Product Offerings
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